20g Solder Paste Flux Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair – toolsindo.id

Detail Produk

Rp222.200

20g Solder Paste Flux Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair

Name: 20g Solder Paste Flux Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair
Brand: Toolsindo.id
SKU: 4001222547058
Price: 222200 IDR
Availability: InStock

215 terjual

SKU: 4001222547058 Categories: Tools, Welding Equipment & Supplies

Terjual: 215+ | Toko: Oma International Trade Co. LTD

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Description

20g Solder Paste Flux Melting Point 183℃ Tin Soldering Paste for SMD BGA Reballing Mobile Phone PCB Repair

Specification:
Model : Solder Tin Paste
Melting point :183°
Net Weight : 20g
Application: Mobile phone repair, computer and digital service industries, high-precision circuit board SMT soldering, BGA welding process, etc.

Package :
1 * Solder Paste