Description
QFN8 DFN8 WSON8 Programming Socket Pin Pitch 1.27mm IC Body Size 5*6 mm Clamshell Test Socket ZIF adapter WLCSP 8 socket
Product Features:
a.Clamshell structure socket
b.Adopting engineering material for socket structure,
Strength is high ,lifetime is long
c.Adopting import BeCu material for socket contact
Spring ,thickening gold-plating surface ,impedance is small elasticity is good
d.For 1.27mm pitch package
Material & Performance:
Ø socket Body: PEI
Ø Contacts:Beryllium Copper Alloy
Ø Contact Plating:Gold over Nickel
Ø Operation Force:2.0KG min, the more PINs the greater force
Ø Contact Resistance:50mΩ max
Ø Dielectric:700V AC for 1 minute
Ø Insulation Resistance:1,000MΩ500V DC
Ø Max Current Capacity : 1A
Ø Temperature Rating:-55℃~+175 ℃
Ø Life Span 15,000 Times (Mechanical）
*Usage scenario QFN/QFP/BGA/SOP/TSOP/TSSOP/SSOP/LGA/DFN/EMMC/EMCP/SSD/SOT/DDR/WSON/TF/TO/MCU/adapter/programmerHumid heat/yclic tests/Temperature cycling tests/Programmer Adapter Socket/Test Conversion Burner/Programming test stand/PurposeChip/programmateur adaptateur prise/IC Sockets/IC Connector/Adaptateur de programmeur//OVEN box/flash/BURN-IN/detection/Aging test/Chip programming socket/Chip data recovery test stand/Chip adapter/Burn-in socket/Burning socket/ Socket/IC Connector/prise pour/test benchAdaptateur de prises ICadapter/programmer/BURN-IN/flash/programming/Humid heat，cyclic tests/Temperature cycling tests/IC Test/IC/Chip/Socket Converter Module
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